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基本資訊

上班地點: 新竹縣竹北市新竹縣竹北市高鐡二路32號7樓之一
職務類別: 半導體製程工程師、半導體工程師、生產技術/製程工程師 全職
需求人數: 1 人
更新日期:

工作內容

Job Summary:

The Assembly Engineer is responsible in package development, process development & qualification, assembly process sustaining and assembly related issue resolution. He/She supports the development and qualification of advanced packages, WLCSP, process and material; works with PL, Quality & Reliability and supplier team for assembly engineering project; coordinates with other groups (Q&R, Operations/Planning, Test Engineering) in the resolution of assembly related issues; collaborates with other teams to support factory audit, site certifications & qualification, and package / process transfer between different factories.

Key Responsibilities:

1. Plans and executes qualification and characterization activities including DOE, FMEA and control plans. This can be related to new product or transfer activities.
2. Qualifies new process for conformance to quality, yield and manufacturability requirements.
3. Defines and reviews specifications and procedures appropriate to the manufacturing process or new equipment.
4. Resolves technical problem and challenges which arise during development, manufacturing validation and after production release.
5. Prepares the necessary logistics intended for the qualification of new package/product.
6. Conducts new technology and new materials roadmap for internal engineering database.
7. Meets and works as ADI local representative during customer visits.
8. Conducts continuous process and yield improvement activities through process development/ enhancements.
9. Reviews Engineering & Manufacturing data and disposes the lots that are put on HOLD and lots under MRB after defect analysis is performed.
10. Leads or joins JTRB team to regularly review major assembly engineering projects, quality issues, and provides engineering support to other teams (Ops, planning…)


Qualifications:
• Bachelor/Master’s degree in engineering (EE, ECE, ME, Met Eng’g, ChE or equivalent.)
• >5 years relevant experience in semiconductor manufacturing as Package Development or Assembly Process Engineer.
• Extensive experience in leadframe & laminate-based packages, WLCSP, SiP and other advanced packages.
• Experience in resolving assembly related issues.
• Experience in OSATs / Fab or experience of OSAT management.
• Knowledge in DOE, FMEA, 6-sigma, SPC, 8D or 7-step is preferred.
• Experience in using design tool or software for IC package or material design, e.g, AutoCAD, Cadence.
• MS Office (Powerpoint, Excel, Word) user skills
• Must be assertive and good in both oral and written English communication.

工作待遇: 待遇面議 (經常性薪資達4萬元或以上) 薪資行情

福利制度

法定項目

其他福利

年終獎金

三節獎金/禮品

特殊節日獎金禮品

零食櫃

咖啡吧

不扣薪病假

結婚禮金

社團補助

員工進修補助

旅遊補助

退職金提撥

交通津貼補助

社團活動

家庭日

免費下午茶

優於勞基法特休

伙食津貼

員工團體保險

1. 12天入職特休
2. 15天全薪病假
3. 免費團體保險 (含眷屬)
4. 年度健康檢查
5. 多樣社團活動
6. 嚴選咖啡零食
7. 三節生日禮金
8. 年度旅遊補助
9. 完善教育訓練

工作型態

出差外派: 無需出差外派
上班時段: 日班
休假制度: 依公司規定
管理責任: 不需負擔管理責任

條件要求

接受身份: 上班族
可上班日: 不限
工作經歷: 5年以上
學歷要求: 大學以上
語文條件: 英文 -- 聽 /精通、說 /精通、讀 /精通、寫 /精通

聯絡方式

聯絡人: HR

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