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基本資訊

上班地點: 台中市后里區三豐路4段369號
職務類別: 自動控制工程師、生產設備工程師、半導體設備工程師 全職
需求人數: 1至3 人
更新日期:

工作內容

Our vision is to transform how the world uses information to enrich life. Join an inclusive team focused on one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solution we create help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.

Do you strive in a dynamic work environment? We are looking for highly motivated and dedicated individuals to join us as in our Package Development Engineering Team!



As an Equipment Engineer in HBM/ PWF, you will be responsible for development / support of highly automated and computerized Backend equipment (Assembly). You will lead and/or participate in teams to support, improve, provide innovative solution and recommendation to enhance equipment performance, capabilities and features to meet production and new product requirements. You will require to support, install and qualify Equipment deployed globally to other manufacturing sites in order to most effectively meet customer / product requirements as well as global Assembly and Micron objectives. You will be involved in design and develop of automation solution. You will participate in teams to support site integration / new site development efforts and support global alignment activities.



As an Key Equipment Engineer for PDE (Product Development Engg)'s Key Equipment Group (KEG) team, you will be responsible for working together with other functional groups locally and/or globally to define HBM/ PWF equipment roadmap and establish new equipment capabilities ahead of needs to accomplish organizational and business goals.



You will also be responsible to establish and maintain HBM/ PWF Tool of Records (TOR) for global HVM environment.



Such activities are not limited to defining and developing highly automated and computerized equipment. You will lead and/or participate in teams to support, improve, provide innovative solution and recommendation to enhance equipment performance, capabilities and features to meet production and new product requirements. You will require to support, install and qualify Equipment deployed globally to other manufacturing sites in order to most effectively meet customer / product requirements as well as global Assembly and Micron objectives. You will be involved in design and develop of automation solution. You will participate in teams to support site integration / new site development efforts and support global alignment activities.



The key is to making Micron products with highest possible Quality Equipment and enabling products in the roadmap.



Responsibilities:

Occasional travel may be required.
Define and maintain equipment capabilities, strategy and roadmap
Maintain a matrix on equipment capabilities and constraint
Regularly conduct equipment benchmarking exercise where needed and Develop new equipment functionality.
Engineer robust manufacturing appropriate solutions for HVM and work with site-based Manufacturing Engineering teams to establish new equipment specifications, design requirements, and qualification processes.
Drive efficient and effective manufacturing through systematic continuous improvement activities (e.g. cost reduction, improve quality and delivery performance)
Manage projects from definition through first-of-kind deployment into production.
Establish technical expertise on equipment and processes and provide technical support to Global teams when required.
Collaborate with external equipment suppliers and internal stakeholders (TD, CEM, PIE, PEE, procurement, ATCP, IE, IT, BEAUTO, API, PCS, SMAI) to deliver strategic and innovative solutions to Manufacturing.
Execute TORRB review for network needs.
Occasional travel may be required.

工作待遇: 待遇面議 (經常性薪資達4萬元或以上) 薪資行情

福利制度

﹝以下薪資福利僅適用於台灣美光晶圓科技(股)公司與台灣美光記憶體科技(股)公司正式員工,其他廠區或辦公室及非正式員工薪資福利另議。﹞
☆薪資及獎金制度 ☆
1. 12個月基本薪資+2個月年終獎金(需當年度12月31日當日在職員工方能領取)
2. 工程師職位薪資:
(1)工程師NT54000起
(2)輪班工程師NT46000起 (輪班津貼另計)
(3)具半導體經驗者薪優另議
3. 績效獎金(IPP):按公司營運績效及組織目標成效給與。
4. 即時獎勵(Spot Bonus/Micron Point):發給工作表現卓越之員工。
5. 久任獎勵(Service Award):服務每滿五年之員工,可獲頒特別贈品。
6. 勞工退休金雇主提撥率:8%,優於勞基法規定。
7. 新進員工到職當月即享有特休假(依服務比例按月給予特休),優於勞基法規定。
8. 全薪病假80小時;政府紀念不放假之紀念日給予特別休假,讓同仁有更多的假期安排。
☆教育訓練☆
Micron全球人力培訓主要目標是 - 確保每個成員都能夠獲得展現高績效成果所需要的學習資源。Micron提倡標準化的訓練架構,以便根據團隊成員的職位、工作職能、工作角色和執行的特定工作來識別必要和相關的訓練。Micron 的主要訓練架構:
1. 美光核心職能訓練:包含與法規遵循相關且適用於所有 Micron成員的訓練活動。
2. 地區性/廠區核心要求:包含與法規遵循相關、適用於特定地區或廠區之所有成員的訓練活動。
3. 部門核心職能訓練:包含適用於特定部門內所有成員,包含與安全有關以及單位內訓練活動。
4. 特定工作角色的特定訓練:如領導力訓練、接班人計畫。
5. 除了一般的訓練方法,美光也利用多元的學習方式來達到人力發展目標,如:自我學習方案、工作輪調、專案參與等。
☆福利措施☆
1. 健保、勞工保險及免費團體保險(含壽險、意外、健康醫療團體保險)。員工配偶及子女享有免費健康醫療團體保險。
2. 醫務室,具專業護士駐廠並定期提供專科醫師問診。
3. 生日禮券、生育、婚喪賀奠及急難補助。
4. 提供多條路線之交通車搭乘服務。
5. 設有各式公司社團及康樂活動。
6. 設施完善的停車場。
7. 員工餐廳及便利商店。
8. 社團經費補助。
9. 開放式圖書閱覽室以及健身房。
10. 設備完善的電腦教室與訓練教室。
11. 員工宿舍(台中廠)、租屋補助(桃園廠)。


『美光政策已經且將持續落實所有人力資源活動及福利待遇,不分種族、宗教、膚色、性別、國籍、年齡、殘疾、性向、婚姻狀態、軍籍地位或其他受法律保護之類別。每位經理人、主管及團隊成員均有責任貫徹此政策規定。
人事部門之雇用平權承辦人負責本政策之執行、解答任何相關問題及查核員工遵守政策之成效狀況。申請過程中如需要協助,請聯繫美光人力資源部 04-25218177(免轉分機) / 03-3272988 ext.3425 。』
求職者在招募過程中或受僱於美光時,無須支付費用、押金或承擔債務
Jobseekers are not required to pay fees, deposits or incur debt as part of the recruitment process or for employment with Micron.

工作型態

出差外派: 無需出差外派
上班時段: 日班
休假制度: 依公司規定
管理責任: 不需負擔管理責任

條件要求

接受身份: 上班族、應屆畢業生、外籍人士
可上班日: 一個月內
工作經歷: 不拘
學歷要求: 大學、碩士
語文條件: 英文 -- 聽 /中等、說 /中等、讀 /中等、寫 /中等
其他條件:
Requirements:

Master’s / Bachelor’s degree in a relevant Engineering discipline with an inclination towards software technology.
Immediate knowledge in semiconductor manufacturing assembly techniques and technologies
Excellent problem solving and analytical skills.
Excellent verbal and written communications skills.
Excellent Project management skills.
Understanding of system, Software & IT is preferred.
Highly result driven individual, self-motivated and ability to multi-task and manage dynamic priorities.
Good interpersonal and communication skill and a good team player
Fast learner, with initiative and independence
Ability to participate in a cross-functional team environment
Experience in semiconductor manufacturing and packaging is an advantage

聯絡方式

聯絡人: 台灣人力資源營運中心

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