4/24 Connected Camera 3A System Engineer (AE)(Taipei)(3059163)
- 台北市內湖區
- 經歷不拘
- 碩士
video/photo quality, and also target applications requiring auto white balance, auto exposure control, auto focus, automatic
video/photo quality, and also target applications requiring auto white balance, auto exposure control, auto focus, automatic
呃拍謝,搜尋結果好像很少
可以嘗試調整條件、或看看你專屬的推薦工作
Job function: To join Qualcomm Customer Engineering team and work with world leading WoS (Windows on Snapdragon) compute device makers from design & develop to commercially launch exciting or new Qualcomm compute SoC products. These Customer Engineers are expected to: 【Responsibilities】 Integration, development, system debugging on OEM designs. Porting sensor driver according to OEM specific request/design and in charge of end-to-end support. Handling customer Q&A, and work closely with internal developers. Provide training to customer and communicate internal with feature design detail. 【Minimum Qualification】 Solid expertise and strong knowledge of C/C++ programming. Substantial hands-on experience in camera sensors bring up. Windows on ARM camera software porting (MDD/PDD) Define/explore technical competitiveness of camera SW, including performance, power, MEP , Shutter and 3rd Party AI developer. Plan for Windows camera software, tuning framework, driver development. Understand every aspect of customers' requirements and design. 【Preferred Qualification】 Experience in Qualcomm camera software and bus interfaces: MIPI, I2C. Experience in Qualcomm camera ISP and camera SW framework is a plus. Experience in Windows/ACPI/HLK is a plus. Familiar with the requirements and design of MSFT camera privacy control (shutters and kill switches). 【Education Requirements】 Required: Bachelor's degree in CS, EE, or a closely related field Preferred: Masters degree in CS, EE or a closely related field
Please apply this role from our career site with English resume attached: 【https://qualcomm.wd5.myworkdayjobs.com/External/job/Taipei-TWN/Sr-USB-PCIe-SW-Engineer_3060068】 We will review your profile in priority here, thank you. ====================================== Job function: To join Qualcomm Customer Engineering team and work with world leading WoS (Windows on Snapdragon)/Chrome compute device makers from design & develop to commercially launch exciting or new Qualcomm compute SoC products. These Customer Engineers are expected to: - Understand every aspect of customers' requirements and designs - To communicate with internal product & development teams on any HW/SW design related issues/features from customer designs - To work with customers in resolving any feature development and product commercialization issues. Responsibilities: - Provide training to customer - Assisting customer with some software feature design - Integration, development, system debugging on OEM designs. - Handling customer Q&A, and work closely with internal developers.
a.工作內容: 1. AWB AE algorithm 調校 2. Image pipeline 應用 3. Sensor /Lens 相關應用與控制 4. 影像相關應用之演算法開發(影像分析/辨識) b.需求技能: 1. 熟悉C/C++,能獨立作業 2. 熟悉3A演算法及影像處理者佳 3. 熟悉影像分析者佳 4. 熟悉embedded system programming經驗者佳 5. 熟悉DSP應用與相關經驗者佳
相機影像調適方式優化工程師 1. ISP/3A 參數調教. 2. 改善調適流程以及方法. 3. 改善調適前置軟硬體檢查流程 4. 改善調適工具使用效率
Please apply via career website directly, we will review your profile in priority. https://qualcomm.wd5.myworkdayjobs.com/External/job/Hsinchu-City-TWN/System-Level-Test-Engineer--Staff_3061149 【Job Overview】 The QAM (Qualcomm Automotive Module) test group is responsible for delivering Test solutions for Qualcomm leading-edge Automotive Modules. In this role you will be expected to develop Test solutions including Test plan, Bring up, Test program, Qualification program working with Hardware, Software, System and Design teams. Responsibilities for this position include working with engineering teams for early-stage module bring-up and post-silicon validation efforts, work closely with software teams to evaluate integrated system performance, test, and characterize HW/SW interaction, device performance at various operating conditions (voltage, process and thermal), work with the production test teams to develop system test solution to screen QAM manufacturing issue. The individual selected for the position, needs to be proactive, able to work in a fast-paced dynamic environment. 【Principal Duties and Responsibilities】 • Evaluates, characterizes, and develops Test solutions for Qualcomm automotive module. • Interfaces with various cross-functional teams (e.g. Design, Software/System Engineering, Architecture Development, Packaging Team, Business Groups, Customer Engineering) to drive and incorporate the latest test solutions in the production program to improve the yield, test time, and quality. • Experience in project planning, giving direction to team • Experience in analyzing specifications, creating test plans and test execution is required. • Experience in developing test cases for Android/QNX-based devices is required. • Hands-on debugging/triaging experience on Module level issues using Android debugging tools and/or using JTAG Lauterbach/Trace32 is required. • Work with team to develop automatic reports, dashboards, and charts to share progress growth with key stack holders. • Required Logical reasoning and analytical skills to debug failures. Use technical expertise to identify solutions to test failures. • The candidate is expected to be self-driven to quickly get up to speed on various aspects of test developments & flexible to take up tasks as per the project needs. • Experience working with Perforce, GIT, or other Source Control SW is required. • Experience in production testing (Gauge R&R, shop floor) and handling OSATS is required • Experience on module testing, PCB debugs, SMT issues is required • Should be comfortable with reading Schematics and layout files of HW systems. • Good working knowledge of Android Architecture, Android Boot process, Kernel, Core BSP and Android Performance will be plus. • FA knowledge for driving module debugs is required. • Good system level understanding of the HW platforms having various peripherals like DDR, UFS, USB, Display, Camera, Power management IC is preferred. • Understanding of Module assembly, Boundary scan test and assembly defects will be plus. • Experience in Python, C#, .NET Framework, C/C++, Perl is a plus. • Working knowledge of system level benchmarks (e.g. like Dhrystone, AnTuTu, Monkey Test) will be a plus. 【Preferred qualification】 • Good in Korea • Minimum 8+ years of experience • Able to lead a team of 5+ • Experience in Module/System in Package/Board product testing at NPI or HVM. Experience with automotive product is a plus. • Rich Hands-on System/SW/bench test/ HW-SW interaction test experience, preferably in the Automotive/mobile devices/microprocessor industry. • Highly motivated, fast learner, team player with good communication skills. • Education: Master’s degree in Electrical Engineering, Electronics and Communication and Computer Science engineering. 【Minimum Qualifications】 • Minimum 8+ years • Experience in Module/System in Package/Board product testing at NPI or HVM. • Education: Bachelor’s degree in Electrical Engineering related
Main function •Familiar with the video format and measurement, such as an Analog video, DVP, MIPI, LVDS, etc. •Modify evaluation boards to meet test design targets. •Application circuit design review and debug. •Major in AE or EE and related fields 5+ yrs working experience. •Familiar with the EMC of the vehicle and troubleshooting.