【工程】基板設計工程師(Substrate Design Engineer)
- 新竹縣芎林鄉
- 3年以上
- 大學
1. Flip chip package substrate design. 2. Capable provide optimization design proposal. 3. Capable to co-work with substrate/material suppliers directly. 4. Design rule maintenance. 5. Work closely and Interface with various teams (product, PE group and supplier…etc) 6. A plus for Good command of written and oral in English.