5/07 Senior Package Design Engineer
- 力智電子股份有限公司
- IC設計相關業
- 新竹縣竹北市
- 6年以上
- 碩士
1. Be responsible for power package/module design rule definition and maintance. 2. Be responsible for package structure, material combination and thermal performance analysis. 3. Be responsible for working with subcontractor to release design BOM like leadfarme, substrate, Cu clip, EMC,… 4. Be responsible for providing robust/optimized PKG design through thermal, electrical, mechanical simulation and test. 5. Be responsible for PKG solution to enhance competitive advantage.