半導體設備工程師（HW/Process)

燁霖工程有限公司

台南市善化區

經歷不拘

專科

1.協助現場主管交辦事宜 2.維護現場環境秩序及協助調機／製程工程進行 3.需著無塵服於廠內進行工作 4.可配合輪班制 5.需配合外派出差.時間/地點依公司規定

11~30人應徵

【限定！5/9 新竹地區現場徵才】操作運轉工程師 (新竹竹科)

液空台灣_亞東工業氣體股份有限公司

新竹市

經歷不拘

專科

【液空亞東－新竹地區現場徵才】歡迎新鮮人！日期：5/9(四) 時間：10:00~14:00 地點：新竹市東區龍山西路99號1樓 (新竹市身心障礙者就業綜合大樓) 職務內容：液空亞東因應業務及客戶需求增長，我們目前正於「新竹科學園區」尋找「操作運轉工程師」，負責氣體生產設備巡檢、抄錶、維護、盤控等業務。此職務將有部分工時於戶外及日夜輪班。 1. 依照SOP及廠長的指導下執行日常的工作及維護保養 2. 依照當地法規和公司標準進行日常作業 3. 接受訓練並確定在執行相關任務前已被認證通過 4. 於廠區作業前參與相關討論會議 5. 負責執行廠內改善方案以確保工廠設施之最佳狀況 6. 提出維護保養之服務需求單或工作清單 7. 提出請購申請及其他行政需求 8. 依照公司維護保養作業指導書，準備設備維護保養工作清單必備資格：可接受四二輪班及部分工時於戶外工作環境若您對於外商集團、氣體產業或是工作內容有興趣，歡迎準備好履歷與我們見面！當天無法前來，也歡迎透過104投遞履歷~

0~5人應徵

5/03 PDE PIE Manager

台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)

半導體製造業

台中市后里區

6年以上

大學

Apply Here: https://micron.wd1.myworkdayjobs.com/External/job/Hsinchu---PTI-Office-Taiwan/PDE-PIE-Manager_JR52427 Responsibility: Managing NPI /NPP programs , understand implement DFx for advance packaging qualification for success LVM validation and HVM. Manager NPI activities achieve Project milestone through Phase Gate Review. Review FMEA, SPC and Quality Control Plan / tool implementation and fan-out strategy . Setup metrics to track NPI program KPIs, analysis yield issue and defect failure analysis Excursion management, drive effective CA/PA. Support network projects and BKM implementation. Manage External MFG Partners on Engineering and Operational related issues. Understand external mfg partners equipment, process capability and technology roadmap for Product need. Collaboration with TPM/POM/Operations team to support delivery items related to engineering issues Requirement: Experience: More than 5-10 years’ experience in any of the following: Assembly Process/Equipement engineering Experience in NPI development or technical integration role OSAT management experience, or experience working in subcon will be a plus Education: Minimum must have Bachelor’s Degree in Engineering from a recognized university or related field equivalent technical work experience.

0~5人應徵

5/03 Principal Technology Development Engineer

台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)

半導體製造業

台中市后里區

8年以上

大學

Apply Here: https://micron.wd1.myworkdayjobs.com/External/job/Taichung---Fab-16-Taiwan/Principal-Technology-Development-Engineer_JR46920 JOB DESCRIPTION: Micron’s Assembly Package Technology Development team in Taiwan is looking for a motivated and experienced individual contributor for this position in Process Development team. A good candidate will be developing, configuring and optimizing Package Assembly processes (front end , bonding and back end) for Micron’s memory from pathfinding through to NPI start up and certification side by side with Manufacturing teams. Assessing processes by knowledge and skills, taking measurements and interpreting data are every day responsibilities and expectations for the successful candidate. Other deliverables in this job function are Assembly design rules development working side by side with Design teams (Globally) and you will be involved in the design approvals (Substrate and Silicon), running, testing and upgrading systems and processes, approving the materials, process and equipment changes in the CCB (change control board). An important topic is the path finding of innovative package technology : Deep fundamental understanding of the key risks in Bumping and Flip chip/ TCB technologies. Actual experience with HBM, FOP(Fan Out Package) and WLCSP is a plus. Finally the hands on integration experience in Pkg Assembly and WL package process are needed, may need to conduct the supplier interactions/meetings and drive new NDAs with new projects, which all together requires a significant understanding of the processes, first principles and process control systems. JOB REQUIREMENT Experience needed : > 8 years' experience in semiconductor industry. Family as development experience of Photo, Wafer bonding, wafer de-bonding, and die stacking TCB/ FC process are better. Education level : PhD/Masters Degree in Electrical & Electronic, Material, Mechanical, Chemical Engineering, Physics & Applied Physics, or Equivalent Work Experience Required

0~5人應徵

5/03 PDE Technology development Sr Engineer/Engineer

台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)

半導體製造業

台中市后里區

3年以上

碩士

Apply Here: https://micron.wd1.myworkdayjobs.com/External/job/Taichung---Fab-16-Taiwan/PDE-Technology-development-Sr-Engineer-Engineer_JR52182 JOB DESCRIPTION: Micron’s Assembly Package Technology Development team is looking for a motivated and experienced individual contributor for this position in Process Development team. A good candidate will be developing, configuring and optimizing Package Assembly processes (front end , bonding and back end) for Micron’s memory from pathfinding through to NPI start up and certification side by side with Manufacturing teams. Assessing processes by knowledge and skills, taking measurements and interpreting data are every day responsibilities and expectations for the successful candidate. Other deliverables in this job function are Assembly design rules development working side by side with Design teams (Globally) and you will be involved in the design approvals (Substrate and Silicon), running, testing and upgrading systems and processes, approving the materials, process and equipment changes in the CCB (change control board). An important topic is the path finding of innovative package technology : Deep fundamental understanding of the key risks in Bumping, Flip chip and HBM technologies. Actual experience with TCB(Thermal Compression Bonding ), CMP (Chemical Mechanical Polish), and Ball Mount is a plus. Finally the hands on integration experience in Package Assembly and Wafer Level package process are needed, may need to conduct the supplier interactions/meetings and drive new NDAs with new projects, which all together requires a significant understanding of the processes, first principles and process control systems. JOB REQUIREMENT Experience needed : More than 3 years experience Family as development experience of Photo, PVD, CVD, CMP, wafer level molding, wafer level ball mount, TCB, FC, UF, Hybrid bond, Glass carrier bond/ de-bond are better, Grinding, SD, Dicing, Laser Grooving Education level : PhD/Masters Degree in Electrical & Electronic, Material, Mechanical, Chemical Engineering, Physics & Applied Physics, or Equivalent Work Experience Required